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No. STSE-CC4017B SPECIFICATIONS FOR NICHIA CHIP TYPE WHITE LED MODEL : NSSW020AT NICHIA CORPORATION -0- Nichia STSE-CC4017B Symbol IF IFP VR PD Topr Tstg Tsld Absolute Maximum Rating 30 100 5 120 -30 ~ + 85 -40 ~ +100 Reflow Soldering : 260C Hand Soldering : 350C IFP Conditions : Pulse Width < 10msec. and Duty < 1/10 = = (2) Initial Electrical/Optical Characteristics Item Symbol Forward Voltage VF Reverse Current IR Luminous Intensity Iv ! x Chromaticity Coordinate y ! Please refer to CIE 1931 chromaticity diagram. Condition IF=20[mA] VR= 5[V] IF=20[mA] IF=20[mA] IF=20[mA] Typ. (3.6) (1200) 0.31 0.32 (Ta=25C) Max. Unit 4.0 V 50 A mcd - (3) Ranking Item Rank U2 Rank U1 Rank T2 Rank T1 Symbol Iv Iv Iv Iv Condition IF=20[mA] IF=20[mA] IF=20[mA] IF=20[mA] Min. 1200 1000 860 720 Luminous Intensity (Ta=25C) Max. Unit 1440 mcd 1200 mcd 1000 mcd 860 mcd ! Luminous Intensity Measurement allowance is 10%. Color Ranks x y x y x y 0.280 0.248 0.296 0.276 0.291 0.257 Rank a3 0.264 0.287 0.267 0.295 Rank b5 0.287 0.307 0.295 0.315 Rank b7 0.279 0.302 0.276 0.302 0.296 0.276 0.311 0.294 0.308 0.279 x y x y 0.311 0.294 0.308 0.279 (IF=20mA,Ta=25C) Rank b6 0.307 0.330 0.315 0.339 Rank b8 0.302 0.319 0.302 0.318 0.330 0.318 0.321 0.294 ! Color Coordinates Measurement allowance is 0.01. ! One delivery will include one set of the above color ranks (a3 or b5 and b6 or b7 and b8) and four luminous intensity ranks of the products. The quantity-ratio of the ranks is decided by Nichia. -1- Nichia STSE-CC4017B 2.TYPICAL INITIAL OPTICAL/ELECTRICAL CHARACTERISTICS Please refer to figure's page. 3.OUTLINE DIMENSIONS AND MATERIALS Please refer to figure's page. Material as follows ; Package Encapsulating Resin Electrodes : : : Heat-Resistant Polymer Silicone Resin (with Diffused + YAG Phosphor) Ag Plating Copper Alloy 4.PACKAGING * The LEDs are packed in cardboard boxes after taping. Please refer to figure's page. The label on the minimum packing unit shows ; Part Number, Lot Number, Ranking, Quantity * In order to protect the LEDs from mechanical shock, we pack them in cardboard boxes for transportation. * The LEDs may be damaged if the boxes are dropped or receive a strong impact against them, so precautions must be taken to prevent any damage. * The boxes are not water resistant and therefore must be kept away from water and moisture. * When the LEDs are transported, we recommend that you use the same packing method as Nichia. 5.LOT NUMBER The first six digits number shows lot number. The lot number is composed of the following characters; "#$$$$ - !% " - Year ( 3 for 2003, 4 for 2004 ) # - Month ( 1 for Jan., 9 for Sep., A for Oct., $$$$ - Nichia's Product Number ! - Ranking by Color Coordinates % - Ranking by Luminous Intensity B for Nov. ) -2- Nichia STSE-CC4017B 6.RELIABILITY (1) TEST ITEMS AND RESULTS Test Item Resistance to Soldering Heat (Reflow Soldering) Solderability (Reflow Soldering) Thermal Shock Temperature Cycle Moisture Resistance Cyclic High Temperature Storage Temperature Humidity Storage Low Temperature Storage Steady State Operating Life Condition 1 Steady State Operating Life Condition 2 Steady State Operating Life of High Temperature Steady State Operating Life of High Humidity Heat Steady State Operating Life of Low Temperature Vibration Standard Test Method JEITA ED-4701 300 301 JEITA ED-4701 300 303 JEITA ED-4701 300 307 JEITA ED-4701 100 105 JEITA ED-4701 200 203 JEITA ED-4701 200 201 JEITA ED-4701 100 103 JEITA ED-4701 200 202 Test Conditions Tsld=260C, 10sec. (Pre treatment 30C,70%,168hrs.) Tsld=215 5C, 3sec. (Lead Solder) 0C ~ 100C 15sec. 15sec. -40C ~ 25C ~ 100C ~ 25C 30min. 5min. 30min. 5min. 25C ~ 65C ~ -10C 90%RH 24hrs./1cycle Ta=100C Ta=60C, RH=90% Ta=-40C Ta=25C, IF=20mA Ta=25C, IF=30mA Ta=85C, IF=5mA 60C, RH=90%, IF=15mA Ta=-30C, IF=20mA JEITA ED-4701 400 403 JEITA ED-4702 JEITA ED-4702 100 ~ 2000 ~ 100Hz Sweep 4min. 200m/s2 3direction, 4cycles 3mm, 5 1 sec. 5N, 10 1 sec. Note 2 times Number of Damaged 0/50 1 time over 95% 20 cycles 100 cycles 10 cycles 1000 hrs. 1000 hrs. 1000 hrs. 1000 hrs. 500 hrs. 1000 hrs. 500 hrs. 1000 hrs. 48min. 0/50 0/50 0/50 0/50 0/50 0/50 0/50 0/50 0/50 0/50 0/50 0/50 0/50 Substrate Bending Stick 1 time 1 time 0/50 0/50 (2) CRITERIA FOR JUDGING THE DAMAGE Item Symbol Test Conditions Criteria for Judgement Min. Max. Forward Voltage VF Reverse Current IR Luminous Intensity IV *) U.S.L. : Upper Standard Level IF=20mA U.S.L.*)$ 1.1 VR=5V U.S.L.*)$ 2.0 IF=20mA L.S.L.**)$ 0.7 **) L.S.L. : Lower Standard Level -3- Nichia STSE-CC4017B 7.CAUTIONS The LEDs are devices which are materialized by combining Blue LEDs and special phosphors. Consequently, the color of the LEDs is changed a little by an operating current. Care should be taken after due consideration when using LEDs. (1) Moisture Proof Package * When moisture is absorbed into the SMT package it may vaporize and expand during soldering. There is a possibility that this can cause exfoliation of the contacts and damage to the optical characteristics of the LEDs. For this reason, the moisture proof package is used to keep moisture to a minimum in the package. * The moisture proof package is made of an aluminum moisture proof bag with a zipper. A package of a moisture absorbent material (silica gel) is inserted into the aluminum moisture proof bag. The silica gel changes its color from blue to pink as it absorbs moisture. (2) Storage * Storage Conditions Before opening the package : The LEDs should be kept at 30C or less and 90%RH or less. The LEDs should be used within a year. When storing the LEDs, moisture proof packaging with absorbent material (silica gel) is recommended. After opening the package : The LEDs should be kept at 30C or less and 70%RH or less. The LEDs should be soldered within 168 hours (7days) after opening the package. If unused LEDs remain, they should be stored in moisture proof packages, such as sealed containers with packages of moisture absorbent material (silica gel). It is also recommended to return the LEDs to the original moisture proof bag and to reseal the moisture proof bag again. * If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the storage time, baking treatment should be performed using the following conditions. Baking treatment : more than 24 hours at 65 5C * Nichia LED electrode and leadframe are comprised of a silver plated copper alloy. The silver surface may be affected by environments which contain corrosive gases and so on. Please avoid conditions which may cause the LED to corrode, tarnish or discolor. This corrosion or discoloration might lower solderability or might affect on optical characteristics. * Please avoid rapid transitions in ambient temperature, especially in high humidity environments where condensation can occur. (3) Heat Generation * Thermal design of the end product is of paramount importance. Please consider the heat generation of the LED when making the system design. The coefficient of temperature increase per input electric power is affected by the thermal resistance of the circuit board and density of LED placement on the board, as well as other components. It is necessary to avoid intense heat generation and operate within the maximum ratings given in this specification. * The operating current should be decided after considering the ambient maximum temperature of LEDs. -4- Nichia STSE-CC4017B Pre-heat Pre-heat time Peak temperature Soldering time Condition Reflow Soldering Lead Solder Lead-free Solder 180 ~ 200C 120 ~ 150C 120 sec. Max. 120 sec. Max. 240C Max. 260C Max. 10 sec. Max. 10 sec. Max. refer to refer to Temperature - profile 1. Temperature - profile 2. (N2 reflow is recommended.) Hand Soldering Temperature Soldering time 350C Max. 3 sec. Max. (one time only) ! After reflow soldering rapid cooling should be avoided. [Temperature-profile (Surface of circuit board)] Use the conditions shown to the under figure. <1 : Lead Solder> 2.5 ~ 5C / sec. Pre-heating 120 ~ 150C 60sec.Max. Above 200C <2 : Lead-free Solder> 1~ 5C / sec. 240C Max. 10sec. Max. 1~ 5C / sec. Pre-heating 180 ~ 200C 60sec.Max. Above 220C 260C Max. 10sec. Max. 2.5 ~ 5C / sec. 120sec.Max. 120sec.Max. [Recommended soldering pad design] Use the following conditions shown in the figure. 1.5 2.1 1.5 0.85 (Unit : mm) * Occasionally there is a brightness decrease caused by the influence of heat or ambient atmosphere during air reflow. It is recommended that the User use the nitrogen reflow method. * Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable, a double-head soldering iron should be used. It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing. * Reflow soldering should not be done more than two times. * When soldering, do not put stress on the LEDs during heating. * After soldering, do not warp the circuit board. (5) Cleaning * It is recommended that isopropyl alcohol be used as a solvent for cleaning the LEDs. When using other solvents, it should be confirmed beforehand whether the solvents will dissolve the package and the resin or not. Freon solvents should not be used to clean the LEDs because of worldwide regulations. * Do not clean the LEDs by the ultrasonic. When it is absolutely necessary, the influence of ultrasonic cleaning on the LEDs depends on factors such as ultrasonic power and the assembled condition. Before cleaning, a pre-test should be done to confirm whether any damage to the LEDs will occur. -5- Nichia STSE-CC4017B -6- Nichia STSE-CC4017B ICI Chromaticity Diagram 0.9 520 530 0.8 540 510 0.7 550 560 0.6 570 500 0.5 580 590 0.4 b6 0.3 490 a3 0.2 b5 b8 b7 600 610 620 630 y 480 0.1 470 460 0 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 x ! Color Coordinates Measurement allowance is 0.01. -7- ! Forward Voltage vs. Forward Current 200 Forward Current IFP (mA) 100 50 20 10 5 Ta=25C ! Forward Current vs. Relative Luminosity 4.0 Relative Luminosity (a.u.) 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 0 20 40 60 80 100 120 Forward Current IFP (mA) Ta=25C ! Duty Ratio vs. Allowable Forward Current Allowable Forward Current IFP (mA) 200 Ta=25C 100 50 30 20 10 1 1 2.5 3.0 3.5 4.0 4.5 5.0 5.5 Forward Voltage VF (V) 5 10 20 50 100 Duty Ratio (%) ! Ambient Temperature vs. Forward Voltage 5.4 IFP=60mA IFP=20mA IFP=5mA ! Ambient Temperature vs. Relative Luminosity 2.0 Relative Luminosity (a.u.) IFP=20mA 1.0 ! Ambient Temperature vs. Allowable Forward Current Allowable Forward Current IF (mA) 40 30 20 10 6 0 0 20 40 60 80 100 Ambient Temperature Ta (C) Forward Voltage VF (V) -8- 5.0 4.6 4.2 3.8 3.4 3.0 0.5 2.6 -40 -20 0 20 40 60 80 100 Ambient Temperature Ta (C) 0.2 -40 -20 0 20 40 60 80 100 Ambient Temperature Ta (C) Nichia STSE-CC4017B Model NSSW020A NICHIA CORPORATION Title No. CHARACTERISTICS 040325424941 ! Forward Current vs. Chromaticity Coordinate 0.35 Ta=25C 0.34 1mA ! Spectrum Relative Emission Intensity (a.u.) 1.2 1.0 0.8 0.6 0.4 0.2 0 350 450 550 650 Wavelength (nm) 750 Ta=25C IF=20mA 0.33 5mA 20mA 50mA 100mA y 0.32 0.31 0.30 0.29 0.3 0.31 0.32 0.33 0.34 x ! Ambient Temperature vs. Chromaticity Coordinate 0.35 IFP=20mA 0.34 0.33 ! Directivity 1.0 Relative Luminosity (a.u.) Y 0 Ta=25C IFP=20mA X-X Y-Y 10 20 30 X X Y y -9- 40 50 -30C 0.5 60 70 80 0.32 0.31 0C 85C 50C 25C 0.30 0.29 0.30 0.31 0.32 0.33 0.34 0 90 x 60 30 Radiation Angle 0 0.5 90 1.0 Nichia STSE-CC4017B Model NSSW020A NICHIA CORPORATION Title No. CHARACTERISTICS 040325424951 3.4 0.73 1.2 K A Cathode mark C 0.12 3.8 (3.6) 2.3 (1.9) -10- (0.45) +0.13 0.6-0.1 1.2 0.73 0.45 ITEM 0.68 MATERIALS Heat-Resistant Polymer Silicone Resin (with Diffused + YAG Phosphor) Ag Plating Copper Alloy Nichia STSE-CC4017B PACKAGE ENCAPSULATING RESIN ELECTRODES Cathode 0.3 0.38 Anode Model (NOTE) The LED may have flash/flange which exceeds the tolerance of this print. (0.05) NSSW020A Unit mm 15/1 Scale Allow 0.1 NICHIA CORPORATION Title No. OUTLINE DIMENSIONS 040331424961 Taping part 1.5+0.1 -0 40.1 20.05 1.750.1 0.250.05 Reel part 180+0 -3 17.51 13.50.5 Cathode mark 5.50.05 12+0.3 - 0.1 40.1 2 1 0.8 13 0.2 40.1 10.1 1.350.1 0.720.1 Label WHITE LED TYPE NSSW020AT LOT XXXXXX-!! QTY pcs Reel end of tape No LEDs LEDs mounting part No LEDs 60+1 -0 Pull direction Top cover tape Embossed carrier tape -11Reel Lead Min.40mm (No LEDs) Reel Lead Min.320mm (No LEDs is more than 40) Reel Lead Min.400mm Nichia STSE-CC4017B 5,000pcs/Reel Model Taping is based on the JIS C 0806 : Packaging of Electronic Components on Continuous Tapes. NSSW020AT Unit mm Scale Allow NICHIA CORPORATION Title No. TAPING DIMENSIONS 040312424261 Nichia STSE-CC4017B The reel and moisture absorbent material are put in the moisture proof foil bag and then heat sealed. Reel Label Seal NICHIA WHITE LED TYPE LOT QTY NSSW020AT xxxxxx-!" PCS NICHIA CORPORATION 491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN Moisture absorbent material Moisture proof foil bag Empty space in the box is filled with cushion material. Label NICHIA Nichia LED WHITE LED TYPE RANK QTY NSSW020AT !" PCS NICHIA CORPORATION 491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN Packing unit Moisture proof foil bag Cardboard box Cardboard box S Cardboard box M Cardboard box L Reel/bag 1reel Quantity/bag (pcs) 5,000 MAX. Reel/box 4reel MAX. 10reel MAX. 16reel MAX. Quantity/box (pcs) 20,000 MAX. 50,000 MAX. 80,000 MAX. Dimensions (mm) 270!280!100!4t 270!280!200!4t 270!280!300!4t Model NSSW020AT NICHIA CORPORATION Title No. PACKING 040312424271 -12- |
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